Glossary entry (derived from question below)
English term or phrase:
to reduce escape risk
French translation:
pour réduire le risque de perte
Added to glossary by
GILLES MEUNIER
Feb 23, 2019 17:45
5 yrs ago
English term
to reduce escape risk
English to French
Tech/Engineering
Computers: Software
software suite / circuit
Rebonjour,
Est-ce qu'on peut parler de "risque d'évasion" ici ? Je pense qu'il existe un terme plus adapté qui capture l'aspect infaillible en terme d'efficacité.
X helps to reduce escape risk, augment your test coverage and reach unexpected levels of productivity.
Merci :)
Est-ce qu'on peut parler de "risque d'évasion" ici ? Je pense qu'il existe un terme plus adapté qui capture l'aspect infaillible en terme d'efficacité.
X helps to reduce escape risk, augment your test coverage and reach unexpected levels of productivity.
Merci :)
Proposed translations
(French)
5 | pour réduire le risque de perte | GILLES MEUNIER |
4 | pour réduire le risque de fuite/ d'écoulement | FX Fraipont (X) |
Change log
Mar 5, 2019 04:33: GILLES MEUNIER Created KOG entry
Proposed translations
17 hrs
Selected
pour réduire le risque de perte
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Note added at 17 heures (2019-02-24 11:37:01 GMT)
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C'est un terme générique qui ne causera pas de contresens, quel que soit le contexte
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Note added at 17 heures (2019-02-24 11:37:01 GMT)
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C'est un terme générique qui ne causera pas de contresens, quel que soit le contexte
Note from asker:
Merci Gilou ! |
3 KudoZ points awarded for this answer.
17 hrs
pour réduire le risque de fuite/ d'écoulement
Solder escape
"Avoiding Solder Escape/Wick during Reflow
Have you ever wondered why sometimes you have poor Solder joints on your PCB’s!
One of the main reasons is that the Solder Paste flows away from the pad on the PCB during Reflow, this is known as Solder Escape, Solder Wick or Solder Drainage.
Why does this happen, well there are a few reasons but inevitably they are all the result of Thermal Dissipation during the Reflow process. Basically, the heat flows away from the pad on the PCB to a larger Thermal conductive area that’s connected to the pad and unprotected by a Soldermask Dam, these include:"
https://www.eurocircuits.com/blog/tips-tricks-avoiding-solde...
"Avoiding Solder Escape/Wick during Reflow
Have you ever wondered why sometimes you have poor Solder joints on your PCB’s!
One of the main reasons is that the Solder Paste flows away from the pad on the PCB during Reflow, this is known as Solder Escape, Solder Wick or Solder Drainage.
Why does this happen, well there are a few reasons but inevitably they are all the result of Thermal Dissipation during the Reflow process. Basically, the heat flows away from the pad on the PCB to a larger Thermal conductive area that’s connected to the pad and unprotected by a Soldermask Dam, these include:"
https://www.eurocircuits.com/blog/tips-tricks-avoiding-solde...
Peer comment(s):
neutral |
Daryo
: looks very plausible - but Asker should provide enough context to make guessing unnecessary.
6 hrs
|
Discussion
Without this little detail, randomly selecting a synonym in a thesaurus is much quicker and as good ...